Categories of electroplating additives and their applications.
When it comes to electroplating, we have to mention electroplating additives. The role of electroplating additives depends on their function and the material to be plated. Common applications include carriers, brighteners, and leveling agents. The main functions are In optimizing the effect of electroplating, improving the electroplating rate, the uniformity, and brightness of the coating., etc. There is evidence that uses the additives of electroplating in the process can make the quality of electroplating more stable. The following is a list of the main additives and their effects:
Additives for Electroplating
Further reading: Introduction to the electroplating industry
SPS
CAS 27206-35-5
Applications: Copper Plating
- SPS is a brightening agent used for copper electroplating, especially acid copper baths. Copper layers deposited with SPS (CAS 27206-35-5) are very bright, leveled, and ductile.
- SPS is used in copper plating in different industries - such as automotive parts and semiconductors. Copper baths have different goals including changing appearance, enhancing electrical conductivity, or preventing corrosion.
- A combination of SPS (CAS 27206-35-5) and other additives (DPS and ZPS - also manufactured by Hopax) can offer excellent results in functional plating, such as plating on PCB.
MPS
CAS 17636-10-1
Applications: Copper Plating / Precious metals plating
- MPS (3-Mercapto-1-propanesulfonic acid sodium salt) is a brightener for copper electroplating. The copper layer electroplated by MPS is very bright, flat and easy to extend.
- MPS is used as a metal ion chelating agent and also used for the dispersion of nano metal powders. According to research, the addition of MPS leads to a significant increase in the metallization density of electroless copper plating.
- The surface pretreated with MPS is metallized more uniformly than the untreated surface, indicating a better dispersion of nucleation sites.
- In the CMOS copper plating process, the MPS added in the copper sulfate electrolyte is oxidized to form disulfide, which is absorbed by the break of the disulfide bond to inhibit the growth of crystal grains.
ZPS
CAS 49625-94-7
Applications: Copper Plating
- ZPS is used in copper plating in different industries - such as automotive parts and semiconductors. Copper baths have different goals including changing appearance, enhancing electrical conductivity or preventing corrosion. ZPS can be also used for plating precious metals.
- The addition of ZPS in plating solution containing PEG and chlorine ions shows a significant concentration effect on the electroplated Cu film and shear strength of SAC305/Cu solder joint. When ZPS concentration gradually increased to 30 ppm, the number of voids within Cu3Sn layer obviously reduced, improving the stability of the electroplated Cu solder joints subjected to thermal aging.
DPS
CAS 18880-36-9
Applications: Copper Plating
- DPS is used in copper plating in different industries - such as automotive parts and semiconductors. Copper baths have different goals including changing appearance, enhancing electrical conductivity or preventing corrosion.
- It is possible to combine DPS with non-ionic surfactants, aminic polymers, polyethylene glycols, and other sulfur compounds. DPS can be also used as a stabilizer for plating precious metals.
- The more DPS is added to the bath, the lower is the roughness of the films. When concentration of DPS is increased to 34 lM, r.m.s. roughness is as low as 10 nm.
UPS
CAS 21668-81-5
Applications: Electroless Plating
- UPS (CAS 21668-81-5), an activation accelerator that shortens the incubation time in electroless plating.
- In combination with an oxide layer remover (HCl, for example), the incubation time can be further reduced.
- The crystallinity and the peak intensity ratio I(111)/I(200) of plated Cu films were increased with an addition of UPS; the surface of electroplated Cu films become more smooth with an addition of UPS. From the results obtained in this study, it is concluded that UPS was highly effective for void-free filling of trenches.
- UPS can be used as an effective stabilizer for electroless nickel plating. At a lower concentration (less than 30 mg/l), it also can be used as the electroless nickel accelerator.
PPS
CAS 15471-17-7
Applications: Nickel Plating
- PPS is a brightening agent used for nickel electroplating. Nickel layers deposited with use of PPS (CAS 15471-17-7) are very bright, levelled and ductile.
- PPS (CAS 15471-17-7) is used in nickel plating in different industries - such as automotive parts and semiconductors. Nickel baths have different goals including change of appearance, enhance electrical conductivity or prevent corrosion.
- PPS was found capable of supporting the deposition of copper ions at the interconnection and of improving the filling process to obtain void-free TSV interconnections, the "V" (bottom-up) filling model with a PPS concentration of 5 g/L at a current density of 0.2 ASD for 3 h provides a 100% filling ratio without any seams and voids in the interconnection.
- The bath containing the composite additive (BTA 20 mg/L, PPS 10 mg/L, OP-10 50 mg/L and Peregal 20 mg/L) is stable and has a current efficiency 99.3%, throwing power 75.4% and covering power 100.0%. The silver coating has more obvious (111) and(200) orientations and features uniform, compact and smooth crystalline surface, a glossiness of 271 Gs, and excellent adhesion and anti-tarnishing property.
EN 16-80
CAS 26468-86-0
Applications: Electroplating / Zinc plating
- EN 16-80 (CAS 26468-86-0) is a low foaming nonionic surfactant with a high cloud point.
- EN 16-80 (CAS 26468-86-0) is usually used as a brightener in acid zinc baths and has the ability to improve the deposition in the high current densities.
- EN 16-80, NAPE 14-90, and EA15-90 can be used as the surfactants in the indium compositions in the methods for electroplating indium metal on metal layers.
- EN16-80 is used as the surfactant of the aqueous electrolyte in the zinc-oxygen electrochemical cell, Because EN 16-80 has the ability to avoid the formation of zinc dendrites at the anode during the charging process.
- EN 16-80 can increase the life cycle of the zinc-oxygen electrochemical cell.
EA 15-90
CAS 154906-10-2
Applications: Electroplating / Tin plating / Zinc plating
- EA 15-90 (CAS 154906-10-2) usually used in acid zinc baths as a solubilizer for the brightener and as a carrier.
- EA 15-90(CAS 154906-10-2) is a low foaming anionic surfactant without cloud point and stable against hydrolysis over a wide pH range, it is usually combined with nonionic surfactants.
- EA 15-90 (CAS 154906-10-2) has the ability to increases the cloud point of the bath and lead to bright deposits in high and medium current densities.
- EA 15-90 has ether, alcohol, and sulfonate, so it can help to reduce the rough surface of electroplating and inhibit the formation of dendrites.
NAPE 14-90
CAS 120478-49-1
Applications: Electroplating
- NAPE 14-90 is used as a purifying agent in the electroplating process, especially for acid galvanizing.
- The features of NAPE14-90 is low foam, no cloud point, and resistant to hydrolysis.
- If want to increase the cloud point, used in combination with nonionic surfactants can dissolve your question.
- To dissolve in Benzylideneacetone to improve the uniformity of plating.
- NAPE 14-90 can operate at high temperatures and the deposited coating is bright and corrosion-resistant.
Why choose HOPAX
SPS is the most well-known and widely use chemical in copper electroplating additives. And HOPAX have unique technology and being the first manufacturer offer purity over 95% assay product to the market since 2000. With extremely low impurity and low metal residue character, it is commonly using in electronic field and getting more welcome by different customers.
After 2007, we even offer purity 99% product to the market, tofulfill the premium customer’s requirement. Nowadays, we manufacture over hundreds tons of SPS every year. Being the major producer in the market, we never stop to improve SPS quality and capacity.
Pleaselet us knowif you have any special requirement for SPS specification.
Reference:
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